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+1 9498440518
CUSTOM SUPPORT & SALE
support@nexpowers.com
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WHY CHOOSE US
Next in Power, Next in Sustainability
Our Services
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· Value-Added Services
Our Strengths
· Diverse Product Portfolio
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Insulated Gate Bipolar Transistor (IGBT) and diode modules with SPT, SPT+, SPT++ and TSPT+ chips
IGBT and diode modules
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SiC Industrial & e-mobility module,apply to SST,windpower,solar,xEVs,e-trucks,e-busses,raction auxiliary converters, as well as power electronics for xEV charging
SiC modules
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Hitachi Energy's SPT (Soft Punch Through) chipsets and its improved versions with lower losses (SPT+ and SPT++) are available at 1200 and 1700 volt.
IGBT and diode dies
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All Hitachi Energy IGCTs (Integrated Gate-Commutated Thyristors) are press-pack devices.
IGCT
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Hitachi Energy offers a wide range of fast recovery diodes, standard recovery diodes and welding diodes.
Diodes
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Conpact,high-performance,high-power,Plug and Plug IGBT/SiC Driver & Core
Driver
APPLICATION
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Static Var Generator (STATCOM) — Application Guide
STATCOM (Static Synchronous Compensator) is a next-generation dynamic reactive power compensation device based on Voltage Source Converter (VSC) technology. It provides fast, continuous reactive power regulation with response time under 5 milliseconds — far outperforming traditional SVC. A key advantage: output current remains at full capacity even when system voltage dips, making it uniquely effective during grid disturbances.
2026-06-02
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Active Power Filter — Application Guide
APF (Active Power Filter) is a power electronic device designed for dynamic harmonic suppression and reactive power compensation. It detects harmonic components in load current and injects equal-amplitude opposite-phase compensation currents to achieve active harmonic elimination across the full 2nd~50th range with over 97% filtration rate. Unlike passive filters, APF introduces no resonance risk and operates safely in parallel with existing systems.
2026-06-02
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Top 5 Trends in Power Semiconductors for 2025
2024 brought significant challenges for the power semiconductor industry, with weaker demand in the automotive sector, particularly for Electric Vehicles, a slowdown in industrial applications due to geopolitical uncertainties, and a struggling consumer market. These hurdles came at a time when many industry players were heavily investing in capacity expansions, sparking concerns about fab utilization and profitability.
넶43 2025-02-07 -
Intel and TSMC Expand Manufacturing in the US to Bolster Domestic Chip Supply
Intel and TSMC Expand Manufacturing in the US to Bolster Domestic Chip Supply Intel and TSMC are accelerating the construction of their advanced semiconductor fabs in Arizona and Ohio, focusing on creating chips for automotive and defense applications. These efforts aim to address the increasing demand for localized semiconductor manufacturing in the US amidst global supply chain uncertainties.
넶39 2025-02-06 -
Bosch Secures $225 Million Subsidy for SiC Semiconductor Production in California
The US Department of Commerce has announced a preliminary agreement to provide up to $225 million in subsidies to Bosch, a German automotive supplier, to produce silicon carbide (SiC) power semiconductors in California. Bosch plans to invest $1.9 billion to renovate its manufacturing facility in Roseville, California, aiming to boost US capabilities in advanced power semiconductors.
넶48 2025-01-25
NEWS
CONTACT
NexPower Electronics Corporation.
Tel:+1 9498440518
Mail:support@nexpowers.com
Address: 1719 Route 10 East Parsippany, New Jersey 07054,United States of America
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